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XCF32PFSG48C XCF32PFSG48CManufacturer: Xilinx Product Category: Memory Description: Product Technical SpecificationsManufacturer Part Number:XCF32PFSG48C Pbfree Code:Yes Rohs Code:Yes Part Life Cycle Code:Active Ihs Manufacturer:XILINX INC Part Package Code:BGA Package Description:LEAD-FREE, PLASTIC, TFBGA-48 Pin Count:48 Reach Compliance Code:compliant ECCN Code:3A991.B.1.A HTS Code:8542.32.00.51 Manufacturer:Xilinx Risk Rank:1.53 Additional Feature:IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL Data Retention Time-Min:20 Endurance:20000 Write/Erase Cycles JESD-30 Code:R-PBGA-B48 JESD-609 Code:e2 Length:9 mm Memory Density:33554432 bit Memory IC Type:CONFIGURATION MEMORY Memory Width:1 Moisture Sensitivity Level:3 Number of Functions:1 Number of Terminals:48 Number of Words:33554432 words Number of Words Code:32000000 Operating Mode:SYNCHRONOUS Operating Temperature-Max:85 °C Operating Temperature-Min:-40 °C Organization:32MX1 Package Body Material:PLASTIC/EPOXY Package Code:TFBGA Package Equivalence Code:BGA48,6X8,32 Package Shape:RECTANGULAR Package Style:GRID ARRAY, THIN PROFILE, FINE PITCH Parallel/Serial:SERIAL Peak Reflow Temperature (Cel):260 Power Supplies:1.5/3.3,1.8 V Qualification Status:Not Qualified Seated Height-Max:1.2 mm Subcategory:Flash Memories Supply Current-Max:0.04 mA Supply Voltage-Max (Vsup):2 V Supply Voltage-Min (Vsup):1.65 V Supply Voltage-Nom (Vsup):1.8 V Surface Mount:YES Technology:CMOS Temperature Grade:INDUSTRIAL Terminal Finish:Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) Terminal Form:BALL Terminal Pitch:0.8 mm Terminal Position:BOTTOM Time@Peak Reflow Temperature-Max (s):30 Type:NOR TYPE Width:8 mm LastXC6SLX45-2FGG484CNextZKB472107-03-W |
