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XCF01SVOG20C![]() XCF01SVOG20CManufacturer: Xilinx Product Category: Memory Description: Product Technical SpecificationsManufacturer Part Number:XCF01SVOG20C Pbfree Code:Yes Rohs Code:Yes Part Life Cycle Code:Obsolete Ihs Manufacturer:XILINX INC Part Package Code:TSSOP Package Description:TSSOP, TSSOP20,.25 Pin Count:20 Reach Compliance Code:compliant ECCN Code:EAR99 HTS Code:8542.32.00.51 Factory Lead Time:12 Weeks Manufacturer:Xilinx Risk Rank:7.75 Samacsys Description:Platform Flash In-System Programmable Configuration PROMS Samacsys Manufacturer:XILINX Additional Feature:IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL Data Retention Time-Min:20 Endurance:20000 Write/Erase Cycles JESD-30 Code:R-PDSO-G20 JESD-609 Code:e3 Length:6.5024 mm Memory Density:1048576 bit Memory IC Type:CONFIGURATION MEMORY Memory Width:1 Moisture Sensitivity Level:3 Number of Functions:1 Number of Terminals:20 Number of Words:1048576 words Number of Words Code:1000000 Operating Mode:SYNCHRONOUS Operating Temperature-Max:85 °C Operating Temperature-Min:-40 °C Organization:1MX1 Package Body Material:PLASTIC/EPOXY Package Code:TSSOP Package Equivalence Code:TSSOP20,.25 Package Shape:RECTANGULAR Package Style:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Parallel/Serial:SERIAL Peak Reflow Temperature (Cel):260 Power Supplies:1.8/3.3,3.3 V Qualification Status:Not Qualified Seated Height-Max:1.19 mm Standby Current-Max:0.001 A Subcategory:Flash Memories Supply Current-Max:0.01 mA Supply Voltage-Max (Vsup):3.6 V Supply Voltage-Min (Vsup):3 V Supply Voltage-Nom (Vsup):3.3 V Surface Mount:YES Technology:CMOS Temperature Grade:INDUSTRIAL Terminal Finish:Matte Tin (Sn) Terminal Form:GULL WING Terminal Pitch:0.65 mm Terminal Position:DUAL Time@Peak Reflow Temperature-Max (s):30 Type:NOR TYPE Width:4.4 mm LastWPEA-251ACNIBTNextXC6SLX45-2FGG484C |





